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 FIN1108 * FIN1108T (Preliminary) LVDS 8 Port High Speed Repeater
March 2002 Revised May 2003
FIN1108 * FIN1108T (Preliminary) LVDS 8 Port High Speed Repeater
General Description
This 8 port repeater is designed for high speed interconnects utilizing Low Voltage Differential Signaling (LVDS) technology. The FIN1108 accepts and outputs LVDS levels with a typical differential output swing of 330 mV which provides low EMI at ultra low power dissipation even at high frequencies. The FIN1108 provides a VBB reference for AC coupling on the inputs. In addition the FIN1108 can directly accept LVPECL, HSTL, and SSTL-2 for translation to LVDS. The FIN1108T has internal termination across the receiver inputs for reduced part count, reduced stub length and better noise immunity. See Applications section.
Features
s Greater than 800 Mbps data rate s 3.3V power supply operation s 3.5 ps maximum random jitter and 135 ps maximum deterministic jitter s Wide rail-to-rail common mode range s LVDS receiver inputs accept LVPECL, HSTL, and SSTL-2 directly s Ultra low power consumption s 20 ps typical channel-to-channel skew s Power off protection s > 7.5 kV HBM ESD Protection s Meets or exceeds the TIA/EIA-644-A LVDS standard s Available in space saving 48-lead TSSOP package s Open circuit fail safe protection s VBB reference output s FIN1108T (RT) features Internal Termination Resistors
Ordering Code:
Order Number FIN1108MTD FIN1108TMTD (Preliminary) Package Number MTD48 MTD48 Package Description 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Devices also available in Tape and Reel. Specify by appending suffix letter "X" to the ordering code.
(c) 2003 Fairchild Semiconductor Corporation
DS500655
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FIN1108 * FIN1108T (Preliminary)
Pin Descriptions
Pin Name RIN1+, RIN2+, RIN3+, RIN4+, RIN5+, RIN6+, RIN7+, RIN8+ RIN1-, RIN2-, RIN3-, RIN4-, RIN5-, RIN6-, RIN7-, RIN8- Description Non-inverting LVDS Input
Connection Diagram
Inverting LVDS Input
DOUT1+, DOUT2+, Non-inverting Driver Output DOUT3+, DOUT4+, DOUT5+, DOUT6+, DOUT7+, DOUT8+ DOUT1-, DOUT2-, Inverting Driver Output DOUT3-, DOUT4-, DOUT5-, DOUT6-, DOUT7-, DOUT8- EN EN12 EN34 EN56 EN78 VCC GND VBB Driver Enable Pin for All Output Inverting Driver Enable Pin for DOUT1 and DOUT2 Inverting Driver Enable Pin for DOUT3 and DOUT4 Inverting Driver Enable Pin for DOUT5 and DOUT6 Inverting Driver Enable Pin for DOUT7 and DOUT8 Power Supply Ground Reference Voltage Output
Function Table
Inputs EN H H H X L ENxx L L L H X DIN+ H L X X DIN- L H X X Outputs DOUT+ H L H Z Z DOUT- L H L Z Z
Functional Diagram
Fail Safe Case
H = HIGH Logic Level L = LOW Logic Level X = Don't Care Z = High Impedance
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FIN1108 * FIN1108T (Preliminary)
Applications
Signal Optimization via Internal Termination For LVDS signaling in point-to-point applications, receivers or repeaters with on-chip termination are preferable to reduce the overshoot or undershoot due to the reflection caused by stubs at receiver inputs. As a rule of thumb, usually the termination resistor for an LVDS receiver should be placed as close as possible to the receiver, especially for high speed applications. If the distance between termination resistors and receivers is too long, the interconnection will be seen as an un-terminated stub which can produce reflections resulting in higher EMI. Internal termination can effectively smooth out this ringing which can otherwise jeopardize the receiver noise margin. This is important for reliable high-speed operation with tighter required signal settling times. Below is a list of the advantages/disadvantages of internal termination. Internal termination is not suitable for all applications. In order to set a proper VOD at the driver outputs, receivers with on-chip termination resistors only work for point-topoint applications since multi-drop applications would require termination resistor for each receiver, reducing the equivalent termination to RT/n. This would reduce the driver output swing by n.
Advantages: 1. Reduced device count resulting in reduced board space and production cost.
Disadvantages: 1. Without special process treatment, on-chip termination can experience greater temperature variation. This is usually tolerable for low speed applications that have a sufficient unit interval. 2. For applications with high common-mode noise, a center tapped capacitor at the receiver side is desirable to filter out the common-mode voltage noise of the input LVDS signal. This scheme works for an external termination scheme with two (50 each for nominal 100 termination resistor) half-value termination resistors connected in series and center tapped to a capacitor to Ground. To implement this scheme using internal termination resistors, a center tap pin would have to be used. This would increase the package size of the part.
2. Reduced reflections caused by the stub length on the receiver inputs, improving the signal integrity.
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FIN1108 * FIN1108T (Preliminary)
Absolute Maximum Ratings(Note 1)
Supply Voltage (VCC) LVDS DC Input Voltage (VIN) LVDS DC Output Voltage (VOUT) Driver Short Circuit Current (IOSD) Storage Temperature Range (TSTG) Max Junction Temperature (TJ) Lead Temperature (TL) (Soldering, 10 seconds) ESD (Human Body Model) ESD (Machine Model) 260C 7500V 400V
-0.5V to +4.6V -0.5V to +4.6V -0.5V to +4.6V
Continuous 10 mA
Recommended Operating Conditions
Supply Voltage (VCC) Magnitude of Differential Voltage (|VID|) Common Mode Voltage Range (VIC) Operating Temperature (TA) (0V + |VID|/2) to (VCC - |VID|/2) 100 mV to VCC 3.0V to 3.6V
-65C to +150C
150C
-40C to +85C
Note 1: The "Absolute Maximum Ratings": are those values beyond which damage to the device may occur. The databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature and output/input loading variables. Fairchild does not recommend operation of circuits outside databook specification.
DC Electrical Characteristics
Symbol VTH VTL VIH VIL VOD VOD VOS VOS IOS Parameter Differential Input Threshold HIGH Differential Input Threshold LOW Input HIGH Voltage (EN or EN) Input LOW Voltage (EN or EN) Output Differential Voltage VOD Magnitude Change from Differential LOW-to-HIGH Offset Voltage Offset Magnitude Change from Differential LOW-to-HIGH Short Circuit Output Current DOUT+ = 0V and DOUT- = 0V, Driver Enabled VOD = 0V, Driver Enabled IIN IOFF ICCZ ICC IOZ VIC CIN COUT VBB RT Input Current (EN, EN, DINx+, DINx-) VIN = 0V to VCC, Other Input = VCC or 0V (for Differential Inputs) Power Off Input or Output Current Disabled Power Supply Current Power Supply Current Disabled Output Leakage Current Common Mode Voltage Range Input Capacitance Output Capacitance Output Reference Voltage Terminating Resistance VCC = 3.3V, IBB = 0 to -275 A 1.125 Enable Input LVDS Input VCC = 0V, VIN or VOUT = 0V to 3.6V Drivers Disabled Drivers Enabled, Any Valid Input Condition Driver Disabled, DOUT+ = 0V to 3.6V or DOUT- = 0V to 3.6V VID/2 3 3 3 1.2 100 1.375 -3.4 3.4 RL = 100 , Driver Enabled, See Figure 2 1.125 1.23 Test Conditions See Figure 1; VIC = +0.05V, + 1.2V, or VCC - 0.05V See Figure 1; VIC = +0.05V, + 1.2V, or VCC - 0.05V -100 2.0 GND 250 330 VCC 0.8 450 25 1.375 25 -6 6 20 20 20 80 20 VCC - (VID/2) Min Typ (Note 2) 100 Max Units mV mV V V mV mV V mV mA mA A A mA mA A V pF pF V
Note 2: All typical values are at TA = 25C and with VCC = 3.3V.
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FIN1108 * FIN1108T (Preliminary)
AC Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified
Symbol tPLHD tPHLD tTLHD tTHLD tSK(P) tSK(LH), tSK(HL) tSK(PP) fMAX tPZHD tPZLD tPHZD tPLZD tDJ tRJ Parameter Differential Output Propagation Delay LOW-to-HIGH Differential Output Propagation Delay HIGH-to-LOW Differential Output Fall Time (80% to 20%) Pulse Skew |tPLH - tPHL| Channel-to-Channel Skew (Note 4) Part-to-Part Skew (Note 5) Maximum Frequency (Note 6)(Note 7) Differential Output Enable Time from Z to HIGH Differential Output Enable Time from Z to LOW Differential Output Disable Time from HIGH to Z Differential Output Disable Time from LOW to Z LVDS Data Jitter, Deterministic LVDS Clock Jitter, Random (RMS) VID = 300 mV, PRBS = 223 - 1, VIC = 1.2V at 800 Mbps VID = 300 mV, VIC = 1.2V at 400 MHz RL = 100 , CL = 5 pF, See Figure 2 and Figure 3 400 >630 3 3.1 2.2 2.5 80 1.9 5 5 5 5 135 3.5 RL = 100 , CL = 5 pF, VIC = VID/2 to VCC - (VID/2), Duty Cycle = 50%, See Figure 1 and Figure 1 Differential Output Rise Time (20% to 80%) VID = 200 mV to 450 mV, Test Conditions Min Typ (Note 3) 0.75 0.75 0.29 0.29 1.1 1.1 0.4 0.4 0.02 0.02 0.02 1.75 1.75 0.58 0.58 0.2 0.15 0.5 Max Units ns ns ns ns ns ns ns MHz ns ns ns ns ps ps
Note 3: All typical values are at TA = 25C and with VCC = 3.3V. Note 4: tSK(LH), tSK(HL) is the skew between specified outputs of a single device when the outputs have identical loads and are switching in the same direction. Note 5: tSK(PP) is the magnitude of the difference in propagation delay times between any specified terminals of two devices switching in the same direction (either LOW-to-HIGH or HIGH-to-LOW) when both devices operate with the same supply voltage, same temperature, and have identical test circuits. Note 6: Passing criteria for maximum frequency is the output VOD > 250 mV and the duty cycle is better than 45% / 55% with all channels switching. Note 7: Output loading is transmission line environment only; CL is < 1 pF of stray test fixture capacitance.
FIGURE 1. Differential Receiver Voltage Definitions
Note A: All LVDS input pulses have frequency = 10 MHz, tR or tF < = 0.5 ns Note B: CL includes all probe and jig capacitances
FIGURE 3. Differential Driver Propagation Delay and Transition Time Test Circuit FIGURE 2. Differential Driver DC Test Circuit
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FIN1108 * FIN1108T (Preliminary)
FIGURE 4. AC Waveform
Note A: All LVTTL input pulses have frequency = 10MHz, tR or tF < = 2 ns Note B: CL includes all probe and jig capacitances
FIGURE 5. Differential Driver Enable and Disable Circuit
FIGURE 6. Enable and Disable AC Waveforms
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FIN1108 * FIN1108T (Preliminary) LVDS 8 Port High Speed Repeater
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide Package Number MTD48
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 7 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com
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